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Lead Free IR Hot Air 10 Zones SMT Reflow Soldering Oven
Lead-free Hot Air Reflow Oven can meet high-end SMD soldering requirements, such as Consumer Electronics, Home Appliances, Instruments and Apparatus, LED high power lighting products and so on.
Heating System | |
Number of heating zones | Up 10 Bottom 10 |
Heating passage | 3890MM |
No. of Cooling Zone | Up 2 Bottom 2 |
Cooling style | Force cooling air |
Conveyor System | |
Max. Width of PCB | 400mm |
Mesh belt width | 450mm |
Conveyor Direction | L→R(or R→L) |
Process Height | 880±20mm |
Conveyor type | Mesh Belt and Chain Conveyor |
Conveyor speed | 0-1000mm/min |
Fixed track | Front track fixed(option: rear track fixed) |
Control System | |
Power supply | 5 line 3 phase 380V 50/60Hz |
Total power consumption | |
Startup power consumption | 42kw |
Steady consumption | 8-12KW |
Ramp Up time | About 25 mins |
Temp. setpoint | Room temperature-300℃ |
Temp. control method | PID close loop control + PC |
Temp. control precision | ±1℃ |
Temp. deviation on PCB | ±2℃ |
Data storage | Process Data and status storage (80 GB) |
Nozzle plate | Aluminum Alloy Plate |
Abnormal Alarm | Abnormal temp. (overtemp/low temp.) |
Board dropped alarm | Tower light: Amber-warning, Green-normal, Red-abnormal |
General | |
Dimension(L*W*H) | 5800×1320×1490mm |
Weight | 2150KG |
Color | Computer grey |